The Electronic, MEMS and Nanoelectronics Systems Packaging Center Scholarship (EMNSPC)

The award will be scholarships in the amount of $1,000 each ($500 Fall Semester, $500 Spring Semester) for up to two years.*

The award recipient will be:

• Graduate Mechanical Engineering Student with an interest and focus in Electronic Packaging
• Must have, or currently enrolled, in one of the two courses in electronic packaging (either Fall or Spring course) and is expected to
obtain the Certificate in Electronic Packaging (15 credit hours related to EMNSPC)
http://grad.pci.uta.edu/about/catalog/current/schools/engineering/mae/
• GPA – 3.2/4.0 (minimum)
• Must have worked with the EMNSPC research team for at least one semester

The contributions to the research, as recommended by the EMNSPC Director, will form 3/4th of the basis for the scholarship (a score given out of 100). The other 1/4th of the recommendation will be based on GPA and how close the student is to completing the certificate program.

*International Student recipient may qualify for tuition waiver.

Attend one of the weekly meetings for the EMNSPC Grad Team to obtain more information.